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CORFIL® 658
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | CORFIL® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | hpQBku_CORFIL-658.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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CORFIL 658 is a one-part epoxy material designed for use in insert or edge filling of honeycomb structure. The low viscosity of CORFIL 658 makes it especially suitable for automated or hand filling of small cell sized honeycomb. The thixotropic nature of CORFIL 658 ensures that there is no slump or resin separation during cure. CORFIL 658 is shipped frozen in sealed metal pails or plastic tubes packed with dry ice or by refrigerated carrier. FEATURES & BENEFITS Excellent spreadability and extrudability Compatible with most 350°F (177°C) curing epoxy prepregs Good compressive strength SUGGESTED APPLICATIONS Filling of honeycomb core in sandwich structures, especially in co-bond or co-cure applications |
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| Physical | Nominal Value | Unit | |
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| Specific Gravity | 0.650 to 0.750 | g/cm³ |
| Mechanical | Nominal Value | Unit | |
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| Compressive Strength (24°C) | 44.8 | MPa |
| Additional Information | Nominal Value | Unit | |
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| Volatiles | < 1.0 | % |
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