Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | hZKLVp_EPO-TEK-H44.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 388 | °C | TGA |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Weight Loss on Heating (300°C) | 0.060 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life (23°C) | 26 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | Brown | ||
Viscosity 2(23°C) | > 820 | Pa·s | |
Curing Time (150°C) | 1.0 | hr |
Cured Properties | Nominal Value | Unit | Test Method |
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Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | 0.5 rpm |
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