NEMCON H PC DP164

Category: PC , Polycarbonate
Manufacturer: Ovation Polymers Inc.
Trademark: NEMCON H
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: hAhEi2_NEMCON-H-PC-DP164.pdf
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PC based, thermally conducting, electrically insulating grade with improved processability.
General Information
Features
  • Electrically Insulating
  • Good Processability
  • Thermally Conductive
Processing Method
  • Injection Molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.35g/cm³ASTM D792
MechanicalNominal ValueUnitTest Method
Tensile Modulus 1(23°C)3950MPaASTM D638
Tensile Strength 2(Break, 23°C)27.0MPaASTM D638
Tensile Elongation 3(Break, 23°C)1.2%ASTM D638
Flexural Modulus 4(23°C, 50.0 mm Span)3690MPaASTM D790
Flexural Strength 5(Break, 23°C, 50.0 mm Span)38.0MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (23°C)130J/mASTM D256
ThermalNominal ValueUnitTest Method
Thermal Conductivity Internal Method
    23°C 61.3 to 1.5W/m/K
    23°C 75.5 to 8.0W/m/K
InjectionNominal ValueUnit
Drying Temperature 100°C
Drying Time 4.0hr
Suggested Max Moisture 0.050%
Rear Temperature 250 to 260°C
Middle Temperature 260 to 270°C
Front Temperature 260 to 280°C
Nozzle Temperature 270 to 290°C
Processing (Melt) Temp 270 to 290°C
Mold Temperature 110 to 130°C
Back Pressure 0.414 to 0.689MPa
Screw Speed 60 to 120rpm
Note Message
1 .50 mm/min
2 .50 mm/min
3 .50 mm/min
4 .1.3 mm/min
5 .1.3 mm/min
6 .Through Plane
7 .In Plane
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