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BCC Resins HPX-850
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | BCC Products Inc. |
| Trademark: | BCC Resins |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | gtsBF5_BCC-Resins-HPX-850.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions. HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. |
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| Physical | Nominal Value | Unit | Test Method |
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| Specific Gravity | |||
| -- | 0.818 | g/cm³ | ASTM D792 |
| -- | 0.830 | g/cm³ | ASTM D1505 |
| Molding Shrinkage - Flow | 0.020 | % | ASTM D955 |
| Thermal | Nominal Value | Unit | Test Method |
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| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 141 | °C | ASTM D648 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Hardener | Mix Ratio by Weight: 1.0 | ||
| Resin | Mix Ratio by Weight: 6.0 | ||
| Pot Life (24°C) | 120 to 150 | min | |
| Demold Time | 1400 | min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RIGITRON 20433 GF | Ovation Polymers Inc. | PBT | RIGITRON |
| Sindustris PBT TE5001GH | Sincerity Australia Pty Ltd. | PC+PBT | Sindustris PBT |
| Xuchuan XCS-3120 | Xuchuan Chemical (Suzhou) Co., Ltd | PUR, Unspecified | Xuchuan |
| Nycal™ 2150GB40 | Technical Polymers, LLC | Nylon 66 | Nycal™ |
| LNP™ THERMOCOMP™ AR002XXH compound | SABIC Innovative Plastics | ABS | LNP™ THERMOCOMP™ |
