Sumikon® PM-TX115

Category: Phenolic , Phenolic
Manufacturer: SBHPP
Trademark: Sumikon®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: gHEAmr_SumikonPMTX115.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
SUMIKON PM-TX115 is a Heat dissipative themoset molding compounds, Electrical insulative based on Phenolic polymer. It is supplied in the form of Granular/Molding Powder for Molding.
General Information
Filler / Reinforcement
  • Inorganic filler
Features
  • Insulation
Appearance
  • Black
Forms
  • Powder
  • Particles
Processing Method
  • Resin transfer molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 2.10g/cm³JIS K6911
Molding Shrinkage - Flow 0.27%JIS K6911
Water Absorption (Equilibrium)0.13%JIS K6911
MechanicalNominal ValueUnitTest Method
Flexural Modulus 19000MPaJIS K6911
Flexural Strength 115MPaJIS K6911
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength 3.0kJ/m²JIS K6911
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)246°CJIS K6911
Thermal Conductivity 1.5W/m/K
ElectricalNominal ValueUnitTest Method
Dielectric Strength 18.0kV/mmJIS K6911
Arc Resistance 188secJIS K6911
Comparative Tracking Index 200VIEC 60112
Insulation Resistance JIS K6911
    -- 21.0E+12ohmsJIS K6911
    -- 31.0E+11ohmsJIS K6911
Note Message
1 .Method B (step by step)
2 .As molded
3 .After boiling
Resin Grade Manufacturer Category Trademark
TABOREN PC 63 T 20 SILON s.ro PP Copolymer TABOREN
CALP MRP430 Lion Idemitsu Composites Co., Ltd. Polyolefin, Unspecified CALP
Appeel® 20D745 DuPont Packaging & Industrial Polymers AEM+TPC-ET Appeel®
Edgetek™ SF2-40CF/000 NATURAL PolyOne Corporation PPS Edgetek™
HiFill® PA6 GF/B30 HS L BK Techmer Engineered Solutions Nylon 6 HiFill®