Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Sumitomo Bakelite Co., Ltd. |
Trademark: | Sumikon® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | gGxuri_Sumikon-EME-7720S.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Sumikon 7700-Series compounds are multi-functional-type molding compounds developed for overmolded BGA packages. |
General Information | |
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Features |
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Uses |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.97 | g/cm³ | ASTM D792 |
Water Absorption (24 hr) | 0.32 | % | ASTM D570 |
Mechanical | Nominal Value | Unit | Test Method |
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Flexural Modulus (25°C) | 19600 | MPa | ASTM D790 |
Flexural Strength (25°C) | 147 | MPa | ASTM D790 |
Thermal | Nominal Value | Unit | Test Method |
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Glass Transition Temperature | 190 | °C | ASTM E1356 |
Thermal Conductivity | 0.79 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Volume Resistivity | 1.0E+13 | ohms·cm | ASTM D257 |
Thermoset | Nominal Value | Unit | |
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Demold Time (175°C) | 0.50 - 1.7 | min | |
Post Cure Time (175°C) | 2.0 - 8.0 | hr |
Additional Information |
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Spiral Flow, SB-U-03-003: 90 cmGel Time, SB-U-03-005, 175°C: 30 secThermal Expansion, SB-U-02-002, T |
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