| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Devcon |
| Trademark: | Devcon |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | gGgohs_Devcon-DFense-Blok-Surface-Wetting-Agent.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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Thixotropic epoxy gel system that improves ease of application and cured adhesion properties (shear, peel, impact) of Devcon® DFense Blok™ abrasion resistant product. Intended Use:
Product Features:
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| General Information | |
|---|---|
| Features |
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| Appearance |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Volume | 0.892 | cm³/g | |
| Solid content- by Volume | 100 | % |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Temperature Resistance | 149 | °C | |
| Tensile Shear Adhesion | 18.0 | MPa | ASTM D1002 |
| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density 1 | 1.10 | g/cm³ |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Durometer Hardness (Shore D) | 71 | ASTM D2240 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Strength | 46.2 | MPa | ASTM D790 |
| Compressive Strength | 34.7 | MPa | ASTM D695 |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Component a | Mixing ratio by weight: 100 Mixing ratio by capacity: 2.0 | ||
| Component B | Mixing ratio by weight: 44 Mixing ratio by capacity: 1.0 | ||
| Pot Life (22°C) | 12 - 15 | min |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Cured 7 days @ 75°F |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Curing Time | 16 | hr |
| Note Message | |
|---|---|
| 1 . | Mixed |
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