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CORFIL® 615

Category:	Adhesive , Adhesive
Manufacturer:	Cytec Industries Inc.
Trademark:	CORFIL®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	gBKaZz_CORFIL-615.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent "Z" for curing at elevated temperature; Curing Agent "A" for curing at 120°F (49°C); and Curing Agent "DTA" for curing at ambient temperature.

Message

CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material.

Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent "Z" for curing at elevated temperature; Curing Agent "A" for curing at 120°F (49°C); and Curing Agent "DTA" for curing at ambient temperature.

General Information
Features	Good Adhesion High Heat Resistance Low Density Thixotropic
Uses	Adhesives Filling Applications Structural Parts
Appearance	Maroon
Forms	Paste
Processing Method	Potting

Physical	Nominal Value	Unit
Specific Gravity ¹	0.600	g/cm³

Mechanical	Nominal Value	Unit
Tensile Modulus ²	633	MPa
Compressive Strength ³(23°C)	41.4	MPa

Additional Information	Nominal Value	Unit
Cure Cycle ⁴(49°C)	16.0	hr

Note Message
1 .	Curing Agent "A" used with CORFIL 615
2 .	Curing Agent "A" used with CORFIL 615
3 .	Curing Agent "A" used with CORFIL 615
4 .	With 2 hours at room temperature

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