BCC Resins BC 5105

Category: Epoxy , Epoxy; Epoxide
Manufacturer: BCC Products Inc.
Trademark: BCC Resins
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: gBKLxY_BCC-Resins-BC-5105.pdf
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BC 5105 is a clear, unfilled, low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without postcuring. For use above 150°F a post-cure is required. Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. BC 5105 can afford consistent use to 300°F if required. Does not contain VCHD or MDA. Typical uses include constructing vacuum form tools, Injection and compression molds, RTM and RIM molds, and matched dies.
General Information
Features
  • High Heat Resistance
  • Low Viscosity
Uses
  • Laminates
Appearance
  • Clear/Transparent
Forms
  • Liquid
Processing Method
  • Laminating
PhysicalNominal ValueUnitTest Method
Specific Gravity
    -- 1.15g/cm³ASTM D792
    -- 1.13g/cm³ASTM D1505
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)90ASTM D2240
MechanicalNominal ValueUnitTest Method
Tensile Strength (Ultimate)200MPaASTM D638
Flexural Strength (Break)234MPaASTM D790
Compressive Strength 404MPaASTM D695
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)145°CASTM D648
CLTE - Flow 1.6E-5cm/cm/°CASTM D696
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Hardener Mix Ratio by Weight: 17, Mix Ratio by Volume: 20
    Resin Mix Ratio by Weight: 100, Mix Ratio by Volume: 100
Pot Life (24°C)55min
Thermoset Mix Viscosity (24°C)2000cPASTM D2393
Demold Time (24°C)1400min
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