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Wellamid® MRGF25/25 22H-NBK1
| Category: | Nylon 66 , Polyamide 66 |
| Manufacturer: | Wellman Engineering Resins |
| Trademark: | Wellamid® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | fofP3a_Wellamid-MRGF25-25-22H-NBK1.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| Wellamid® MRGF25/25 22H-NBK1 is a Polyamide 66 (Nylon 66) material filled with 40% glass\mineral. It is available in Asia Pacific, Europe, Latin America, or North America. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Appearance |
|
| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.62 | g/cm³ | ISO 1183 |
| Molding Shrinkage | ISO 294-4 | ||
| Across Flow : 23°C | 0.90 to 1.3 | % | |
| Flow : 23°C | 0.20 to 0.60 | % |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Stress (Yield, 23°C) | 135 | MPa | ISO 527-2 |
| Tensile Strain (Yield, 23°C) | 2.0 | % | ISO 527-2 |
| Flexural Modulus (23°C) | 12500 | MPa | ISO 178 |
| Flexural Stress (23°C) | 200 | MPa | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact Strength (23°C) | 6.0 | kJ/m² | ISO 180 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa, Unannealed) | 225 | °C | ISO 75-2/A |
| Melting Temperature (DSC) | 260 | °C | ISO 3146 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
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| HiFill® TPU/I GF30 | Techmer Engineered Solutions | TPU-Polyether | HiFill® |
| Panlite® ML-3500ZEH | TEIJIN LIMITED | PC | Panlite® |
| TECACOMP® PEEK 450 CF30 black 3198 | Ensinger GmbH | PEEK | TECACOMP® |
