EPO-TEK® H20E-HC

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: fPSwpf_EPO-TEK-H20E-HC.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK H20E.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
  • LCD Applications
  • LEDs
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 34ppm
    K+ 17ppm
    Na+ 24ppm
    NH4+ 45ppm
Particle Size < 45.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 372°C
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 175°C
    Intermittent -55 to 275°C
Storage Modulus 3.95GPa
Thixotropic Index 3.48
Weight Loss on Heating
    200°C 0.14%
    250°C 0.42%
    300°C 1.1%
ThermalNominal ValueUnit
CLTE - Flow
    -- 15.3E-5cm/cm/°C
    -- 28.0E-5cm/cm/°C
Thermal Conductivity
    -- 311W/m/K
    -- 423W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 5Silver
    -- 6Silver
Density
    Part A 3.43g/cm³
    Part B 4.38g/cm³
Viscosity 7(23°C)3.5 to 6.0Pa·s
Curing Time (150°C)1.0hr
Pot Life 3600min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)93
Volume Resistivity (23°C)< 8.0E-5ohms·cm
Note Message
1 .Below Tg
2 .Above Tg
3 .150°C/1 Hour Cure
4 .150°C/1 Hour+200°C/1 Hour Cure
5 .Part B
6 .Part A
7 .50 rpm
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