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Bergamid™ B700 G30 H BL244
| Category: | Nylon 6 , Polyamide 6 |
| Manufacturer: | PolyOne Corporation |
| Trademark: | Bergamid™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | f87FAq_Bergamid-B700-G30-H-BL244.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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Glass fiber reinforced PA6 compound |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Appearance |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.36 | g/cm³ | ASTM D792 |
| Molding Shrinkage | 0.30 - 0.60 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength 1 | 160 | MPa | ASTM D638 |
| Flexural Modulus 2 | 8200 | MPa | ASTM D790 |
| Flexural Strength 3 | 250 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Charpy Notched Impact Strength | 11 | kJ/m² | ISO 179 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 210 | °C | ASTM D648 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | > 1.0E+12 | ohms | ASTM D257 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating (3.20 mm) | HB | Internal method |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80.0 - 90.0 | °C | |
| Drying Time | 2.0 - 4.0 | hr | |
| Processing (Melt) Temp | 240 - 280 | °C | |
| Mold Temperature | 65.0 - 85.0 | °C |
| Injection instructions |
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| Injection Pressure: MED-HIGHHold Pressure: MED-HIGHScrew Speed: MODERATEBack Pressure: LOW |
| Note Message | |
|---|---|
| 1 . | 5.0 mm/min |
| 2 . | 1.3 mm/min |
| 3 . | 1.3 mm/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TEKNIFLEX® VAV52005 | Tekni-Films, a div of Tekni-Plex | Film, PVC/PCTFE/PVC | TEKNIFLEX® |
| ColorFast® FRPE400 | LTL Color Compounders, Inc. | LDPE | ColorFast® |
| Plaskon MUF-2A LAR | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
| LNP™ STAT-KON™ MFD03 compound | SABIC Innovative Plastics | PP, Unspecified | LNP™ STAT-KON™ |
| XENOY™ X4830 resin | SABIC Innovative Plastics | PC+PBT | XENOY™ |
