Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxies, Etc. |
Trademark: | Epoxies, Ect. |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | f6Kv36_Epoxies-Ect-20-3035-Cat-30-.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features:
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General Information | |
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Features |
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Uses |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Molding Shrinkage - Flow | 0.20 | % |
Mechanical | Nominal Value | Unit | |
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Flexural Strength | 46.9 | MPa |
Thermal | Nominal Value | Unit | |
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CLTE - Flow | 4.0E-5 | cm/cm/°C | |
Thermal Conductivity | 0.19 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Thermoset Mix Viscosity (25°C) | 15000 | cP |
Additional Information | Nominal Value | Unit | |
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Operating Temperature | -55.0 to 155 | °C | |
Outgassing | |||
% CVCM | 0.0600 | ||
% TMLV | 0.490 |
Uncured Properties | Nominal Value | Unit | |
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Mix Ratio by Weight (PBW) | |||
Part A | 100 | ||
Part B | 21 | ||
Density (25°C) | 0.828 | g/cm³ | |
Viscosity 1(25°C) | 45 | Pa·s | |
Curing Time | |||
100°C | 2.0 to 3.0 | hr | |
85°C | 3.0 to 4.0 | hr | |
Pot Life 2(25°C) | 240 | min |
Cured Properties | Nominal Value | Unit | |
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Water Absorption 3 | 0.050 | % | |
Shore Hardness (Shore D) | 82 | ||
Tensile Strength | 33.1 | MPa | |
Compression Strength | 82.7 | MPa | |
Electric Strength | 15 | kV/mm | |
Relative Permittivity (1 MHz) | 2.73 | ||
Volume Resistivity (25°C) | > 1.0E+13 | ohms·cm | |
Dissipation Factor (1 MHz) | 0.050 |
Note Message | |
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1 . | Part A |
2 . | 100 grams |
3 . | After 24 hours |
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