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Sumikon® PM-TX210
| Category: | Phenolic , Phenolic |
| Manufacturer: | SBHPP |
| Trademark: | Sumikon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | eCtxrR_SumikonPMTX210.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| SUMIKON PM-TX210 is a Heat dissipative themoset molding compounds, Non-electrical insulative based on Phenolic polymer. It is supplied in the form of Granular/Molding Powder for Molding. |
| General Information | |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.73 | g/cm³ | JIS K6911 |
| Molding Shrinkage - Flow | 0.30 | % | JIS K6911 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus | 12500 | MPa | JIS K6911 |
| Flexural Strength | 90.0 | MPa | JIS K6911 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Charpy Notched Impact Strength | 3.3 | kJ/m² | JIS K6911 |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Thermal Conductivity | 0.90 | W/m/K |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Pyramid™ PEEK CC200 (KD2190) | Polymics, Ltd. | PEEK | Pyramid™ PEEK |
| Electrafil® PA6/6 IM C BK | Techmer Engineered Solutions | Nylon 66 | Electrafil® |
| Huafon JF-D-NC8903 | Huafon Group Co., Ltd. | PUR, Unspecified | Huafon |
| Jampilen HP540K | Jam Polypropylene Company | PP Homopolymer | Jampilen |
| Sylvin 83009-60D Natural | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |
