EPO-TEK® E3001

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: dbWSDe_EPO-TEK-E3001.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® E3001 is a one component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
Uses
  • Bonding
  • Electrical/Electronic Applications
  • LEDs
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 45.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 428°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 2.59GPa
Thixotropic Index 2.70
Weight Loss on Heating
    200°C 0.040%
    300°C 0.22%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 90.0°C
CLTE - Flow
    -- 25.0E-5cm/cm/°C
    -- 31.2E-4cm/cm/°C
Thermal Conductivity 0.93W/m/K
ThermosetNominal ValueUnitTest Method
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color Silver
Density 2.75g/cm³
Viscosity 4(23°C)2.0 to 4.1Pa·s
Curing Time (150°C)1.0hr
Pot Life 1400min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)78
Lap Shear Strength (23°C)9.59MPa
Volume Resistivity
    23°C < 5.0E-4ohms·cm
    23°C 57.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .100 rpm
5 .200°C/2 min cure
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