Ablefilm 561

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Henkel Ablestik
Trademark: Ablefilm
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: cyg7rQ_Ablefilm-561.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion.

In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired.

After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces.

This adhesive film is also available in a low temperature cure version.
General Information
Uses
  • Adhesives
  • Bonding
  • Film
Appearance
  • Amber
Forms
  • Pellets
ThermalNominal ValueUnitTest Method
Glass Transition Temperature 150.0°CInternal Method
CLTE - Flow Internal Method
    < 50°C 1.5E-4cm/cm/°C
    > 50°C 4.0E-4cm/cm/°C
Thermal Conductivity 2(121°C)0.30W/m/KInternal Method
ElectricalNominal ValueUnitTest Method
Volume Resistivity 35.0E+12ohms·cmInternal Method
Dielectric Strength 439kV/mmInternal Method
Dielectric Constant 5(1 kHz)7.00Internal Method
Dissipation Factor 6(1 kHz)0.017Internal Method
ThermosetNominal ValueUnitTest Method
Pot Life (23°C)120000min
Shelf Life (-40°C)52wk
Demold Time
    125°C 120min
    150°C 30min
Post Cure Time
    125°C 2.0hr
    150°C 0.50hr
Additional InformationNominal ValueUnitTest Method
Carrier Glass fiber
Lap Shear Internal Method
    Al to Al : 25°C 11.0MPa
    Au to Au : 25°C 11.0MPa
Weight Loss on Heating (300°C) 70.71%Internal Method
Work Life (25°C) 83.0monthInternal Method
Note Message
1 .TMA penetration mode
2 .C-MATIC conductance tester
3 .4-point probe
4 .AC/DC breakdown, leakage and ionization tester
5 .Precision digibridge
6 .Precision digibridge
7 .Thermogravimetric Analyzer
8 .25% increase in viscosity @ RT
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