Plaskon 3400F-14 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.

General Information
Features	Semi-conductive Laser marking Fast molding cycle Fast curing Good formability Excellent appearance
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.80	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus	1.52	MPa	ASTM D790
Flexural Strength	0.0124	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	150	°C	ASTM E1356
CLTE - Flow	2.1E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	16	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.6E+16	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.80		ASTM D150
Dissipation Factor (1 kHz)	2.0E-3		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	32	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 177°C, 1000 psi: 54 to 78 cmAutomatic Orifice Viscosity, 175°C, 1000 psi, 1 mm die length, 1/2 mm diameter: 10 to 16 Pascal secRam Follower Gel Time, 177°C: 8 secAsh Content: 71.4 %Hydrolyzable Halides: <10 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 177°C, 1000 psi: 54 to 78 cmAutomatic Orifice Viscosity, 175°C, 1000 psi, 1 mm die length, 1/2 mm diameter: 10 to 16 Pascal secRam Follower Gel Time, 177°C: 8 secAsh Content: 71.4 %Hydrolyzable Halides: <10 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 170 to 185°C Molding Pressure: 750 to 1000 psi Cure Time, 177°C: 20 to 26min Post Mold Cure Time, 175°C: 4 to 12 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	cxw5Mg_Plaskon-3400F-14.pdf
PRICE:	Order Products email sales@su-jiao.com

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