Plaskon 3400F-14

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Cookson Electronics - Semiconductor Products
Trademark: Plaskon
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: cxw5Mg_Plaskon-3400F-14.pdf
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Message
This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.
General Information
Features
  • Semi-conductive
  • Laser marking
  • Fast molding cycle
  • Fast curing
  • Good formability
  • Excellent appearance
Forms
  • Liquid
Processing Method
  • Resin transfer molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.80g/cm³ASTM D792
MechanicalNominal ValueUnitTest Method
Flexural Modulus 1.52MPaASTM D790
Flexural Strength 0.0124MPaASTM D790
ThermalNominal ValueUnitTest Method
Glass Transition Temperature 150°CASTM E1356
CLTE - Flow 2.1E-5cm/cm/°CASTM D696
Thermal Conductivity 16W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Volume Resistivity 1.6E+16ohms·cmASTM D257
Dielectric Strength 16kV/mmASTM D149
Dielectric Constant (1 kHz)3.80ASTM D150
Dissipation Factor (1 kHz)2.0E-3ASTM D150
Arc Resistance 180secASTM D495
FlammabilityNominal ValueUnitTest Method
Flame Rating (3.18 mm)V-0UL 94
Oxygen Index 32%ASTM D2863
Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 177°C, 1000 psi: 54 to 78 cmAutomatic Orifice Viscosity, 175°C, 1000 psi, 1 mm die length, 1/2 mm diameter: 10 to 16 Pascal secRam Follower Gel Time, 177°C: 8 secAsh Content: 71.4 %Hydrolyzable Halides: <10 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 60 cm^-6/cm/°C
Injection instructions
Resin Transfer Molding: Molding Temperature: 170 to 185°C Molding Pressure: 750 to 1000 psi Cure Time, 177°C: 20 to 26min Post Mold Cure Time, 175°C: 4 to 12 hr
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