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THERMALGRAPH® DKD
| Category: | Carbon/Epoxy , Carbon/Epoxy |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | THERMALGRAPH® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | cRQWiw_THERMALGRAPH-DKD.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| ThermalGraph® DKD is a pitched-based high thermal conductivity fiber developed for thermal management applications. The fiber has a longitudinal thermal conductivity 50% higher than copper and a tensile modulus in excess of 100 Msi. The discontinuous nature of the fiber allows a free-flowing product form which can be blended and compounded with other materials. ThermalGraph DKD is especially useful in producing thermally conductive plastics and metal-matrix composites. |
| General Information | |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Specific Gravity 1 | 2.15 to 2.20 | g/cm³ |
| Mechanical | Nominal Value | Unit | |
|---|---|---|---|
| Tensile Strength | 1380 | MPa |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Thermal Conductivity 2 | 400 to 650 | W/m/K |
| Note Message | |
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| 1 . | Fiber Density |
| 2 . | Estimated |
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| SUMIKASUPER® LCP E7008 | Sumitomo Chemical Co., Ltd. | LCP | SUMIKASUPER® LCP |
| Hostaform® LX90Z | Celanese Corporation | Acetal (POM) Copolymer | Hostaform® |
| Plavis® MS | Comco Nylon GmbH | PI, TP | Plavis® |
