Plaskon MUF-LFG Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.

General Information
Features	Semi-conductive Low warpage Workability, good
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	2.00	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	2.45	MPa	ASTM D790
260°C	0.0686	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.0132	MPa	ASTM D790
260°C	0.00127	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	135	°C	ASTM E1356
CLTE - Flow	9.0E-6	cm/cm/°C	ASTM D696
Thermal Conductivity	0.70	W/m/K	ASTM C177

Flammability	Nominal Value		Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 160 cmShimadzu Viscosity, 175°C, 1000 psi: 30 poiseRam Follower Gel Time, 175°C, 1000 psi: 25 secAsh Content: 87.5 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.25%Filler Size, Max in traces: 40 µFiller Size, average: 6 µCull Hot Hardness, Shore D: 65All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 40 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 160 cmShimadzu Viscosity, 175°C, 1000 psi: 30 poiseRam Follower Gel Time, 175°C, 1000 psi: 25 secAsh Content: 87.5 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.25%Filler Size, Max in traces: 40 µFiller Size, average: 6 µCull Hot Hardness, Shore D: 65All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 40 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 165 to 185°C Molding Pressure: 1000 psi In Mold Cure Time: 50 to 100 sec Post Mold Cure Time, 175°C: 0 to 2 hr

Resin Grade	Manufacturer	Category	Trademark
PONACOM PE 4407	Ponachem Compound GmbH	HDPE	PONACOM PE
PROTEQ™ L24C4	Marplex Australia Pty. Ltd.	PP Copolymer	PROTEQ™
T-Blend® 9203B-N85E	TSRC Corporation	SEBS	T-Blend®
Gallonprene® GP200-25Q	Shenzhen Sungallon Rubber & Plastic Corporation Limited	TPE	Gallonprene®
G-Lex P54A001	Gas Authority of India Limited	HDPE	G-Lex

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	cFgNYV_Plaskon-MUF-LFG.pdf
PRICE:	Order Products email sales@su-jiao.com