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EPO-TEK® H70E
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | bbgAlo_EPO-TEK-H70E.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type - Cl- | 186 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 451 | °C | TGA |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 5.43 | GPa | |
| Thixotropic Index | 1.17 | ||
| Weight Loss on Heating | |||
| 200°C | 0.24 | % | |
| 250°C | 0.75 | % | |
| 300°C | 1.6 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.5E-5 | cm/cm/°C | |
| -- 3 | 6.4E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.90 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Beige | ||
| -- 5 | Grey | ||
| Density | |||
| Part A | 1.50 | g/cm³ | |
| Part B | 2.49 | g/cm³ | |
| Viscosity 6(23°C) | 4.0 to 7.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 3400 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 83 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 4.22 | ||
| Volume Resistivity | > 1.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 4.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 50 rpm |
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