Plaskon SMT-B-1LAS Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.

General Information
Features	Semi-conductive Good dimensional stability Low warpage Low viscosity High temperature strength Fast curing
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.88	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.050	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
21°C	1.37	MPa	ASTM D790
215°C	0.588	MPa	ASTM D790
Flexural Strength			ASTM D790
21°C	0.0108	MPa	ASTM D790
215°C	0.00441	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	220	°C	ASTM E1356
CLTE - Flow	1.6E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	0.70	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+15	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.70		ASTM D150
Dissipation Factor (1 kHz)	2.1E-3		ASTM D150

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	34	%	ASTM D2863

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 140 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 45 poiseRam Follower Gel Time, 175°C, 1000 psi: 15 secAsh Content: 77 %Hydrolyzable Halides: <1 ppmAlpha Particle Count: <0.001 counts/cm²/hrCull Hot Hardness, Shore D, 90 sec, 175°C: 75Volume Resistivity, 22°C: 1e15 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 68 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 140 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 45 poiseRam Follower Gel Time, 175°C, 1000 psi: 15 secAsh Content: 77 %Hydrolyzable Halides: <1 ppmAlpha Particle Count: <0.001 counts/cm²/hrCull Hot Hardness, Shore D, 90 sec, 175°C: 75Volume Resistivity, 22°C: 1e15 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 68 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Preheat Temperature: 90 to 100°C Molding Temperature: 170 to 185°C Molding Pressure: 750 to 1000 psi Cure Time, 177°C: 2 to 3min Post Mold Cure Time, 175°C: 4 to 5 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	bNbET6_Plaskon-SMT-B-1LAS.pdf
PRICE:	Order Products email sales@su-jiao.com

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