DOW™ Electrical & Telecommunications HFDK-0586 BK Datasheet,Ethylene Copolymer,The Dow Chemical Company-SHANGHAI SUSHENG

Message
HFDK-0586 BK is a crosslinkable semiconductive compound based on an ethylene copolymer and is designed for conductor shield and bonded insulation shield for use in medium and high voltage cables. HFDK-0586 BK has an excellent compatibility with both copper and aluminium. It has an excellent conductivity, excellent mechanical properties, also after ageing. The smoothness and the extrudability (also in triple extruders) are very good. Specifications: Cables with conductor or insulation shielding of HFDK-0586 BK, prepared using sound commercial fabrication practice, should meet the latest edition of the following industry cable specifications: AIEC: CS 8-00 and CS 7-93 BS: 6622 DIN: VDE 0263 and 0276 IEC: 60502 and 60840 ICEA: S 95 658 and S 66 524 (NEMA WC7-1966) NF: C 33-223 HD: 620 S1

General Information
Uses	Semiconductive Shield Underground cable Cable guard Wire and cable applications
Agency Ratings	AEIC CS7-93 AEIC CS8-00 BS 6622 HD 620 S1 ICEA S-66-524 ICEA S-95-658 IEC 60502 IEC 60840 NEMA WC-7 NF C 33-223 VDE 0263
Forms	Particle

Physical	Nominal Value	Unit	Test Method
Density	1.12	g/cm³	ISO 1183/D
Moisture Content - Karl Fischer		ppm	Internal method

Thermal	Nominal Value	Unit	Test Method
Thermoset ¹			IEC 60811-2-1
Elongation with load : 200°C	50	%	IEC 60811-2-1
Elongation without load : 200°C	0.0	%	IEC 60811-2-1

Additional Information	Nominal Value	Unit	Test Method
Moving Die Rheometer			ASTM D5287
Crosslinking Time, T90 : 182°C	5.4	min	ASTM D5287
Maximum Torque, MH : 182°C	11.2	dNm	ASTM D5287
Scorch Time TS1 : 140°C	31.0	min	ASTM D5287

Mechanical	Nominal Value	Unit	Test Method
Tensile Strength ²	20.0	MPa	IEC 60811-1-1
Tensile Elongation ³(Break)	> 200	%	IEC 60811-1-1

Aging	Nominal Value	Unit	Test Method
Change in Tensile Strength ⁴(150°C, 240 hr)	< 25	%	IEC 60811-1-2
Change in Ultimate Elongation ⁵(150°C, 240 hr)	< 25	%	IEC 60811-1-2

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity ⁶			IEC 60093
23°C	40	ohms·cm	IEC 60093
90°C	< 1.0E+2	ohms·cm	IEC 60093

Additional Information	Nominal Value	Unit	Test Method
Storage: DHDK-0586 BK should be protected from moisture, heat and light. When stored correctly the storage life is 12 months.

Extrusion	Nominal Value	Unit
Drying Temperature	60.0	°C
Drying Time	2.0 - 6.0	hr

Extrusion instructions
HFDK-0586 BK crosslinkable semiconductive compound provides excellent surface finish and output rates. Optimum results are achieved when the processing conditions are optimized for the actual equipment.Pre-drying of the granules to remove moisture is recommended prior to extrusion at 60°C for two to six hours. Extruder barrel settings of 110°C to 125°C are suggested as a starting point while learning to process HFDK-0586 BK.

Extrusion instructions

HFDK-0586 BK crosslinkable semiconductive compound provides excellent surface finish and output rates. Optimum results are achieved when the processing conditions are optimized for the actual equipment.Pre-drying of the granules to remove moisture is recommended prior to extrusion at 60°C for two to six hours. Extruder barrel settings of 110°C to 125°C are suggested as a starting point while learning to process HFDK-0586 BK.

Note Message
1 .	0.40 MPa, measured on crosslinked compression moulded samples.
2 .	Measured on crosslinked compression moulded samples.
3 .	Measured on crosslinked compression moulded samples.
4 .	Measured on crosslinked compression moulded samples.
5 .	Measured on crosslinked compression moulded samples.
6 .	Measured on crosslinked compression moulded samples.

Category:	Ethylene Copolymer , Crosslinkable Semiconductive Shielding Compound
Manufacturer:	The Dow Chemical Company
Trademark:	DOW™ Electrical & Telecommunications
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	bNHYKU_DOW-Electrical-Telecommunications-HFDK-0586-BK.pdf
PRICE:	Order Products email sales@su-jiao.com

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