Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | apQLbO_EPO-TEK-430.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
---|
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. |
General Information | |
---|---|
Filler / Reinforcement |
|
Features |
|
Uses |
|
Agency Ratings |
|
RoHS Compliance |
|
Forms |
|
Physical | Nominal Value | Unit | |
---|---|---|---|
Ion Type | |||
Cl- | 33 | ppm | |
K+ | > 1 | ppm | |
Na+ | 5 | ppm | |
NH4+ | 63 | ppm | |
Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | |
---|---|---|---|
Degradation Temperature | 420 | °C | |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 250 | °C | |
Intermittent | -55 to 350 | °C | |
Storage Modulus (23°C) | 4.19 | GPa | |
Weight Loss on Heating | |||
200°C | 0.18 | % | |
250°C | 0.27 | % | |
300°C | 0.45 | % |
Thermal | Nominal Value | Unit | |
---|---|---|---|
Glass Transition Temperature 1 | > 110 | °C | |
CLTE - Flow | |||
-- 2 | 2.8E-5 | cm/cm/°C | |
-- 3 | 1.4E-4 | cm/cm/°C | |
Thermal Conductivity | 1.3 | W/m/K |
Thermoset | Nominal Value | Unit | |
---|---|---|---|
Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 2.5 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
---|---|---|---|
Color | |||
-- 4 | Amber | ||
-- 5 | Brown | ||
Density | |||
Part B | 1.02 | g/cm³ | |
Part A | 3.55 | g/cm³ | |
Viscosity 6(23°C) | 300 to 400 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 180 | min |
Cured Properties | Nominal Value | Unit | |
---|---|---|---|
Shore Hardness (Shore D) | 86 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
Note Message | |
---|---|
1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 1.0 rpm |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
Amodel® AT-6115 HS | Solvay Specialty Polymers | PPA | Amodel® |
Anjaflam® R450-SZ/F/GF30 | Almaak International GmbH | PBT | Anjaflam® |
Hanwha Total PP TB71W | HANWHA TOTAL PETROCHEMICALS Co., Ltd. | PP, High Crystal | Hanwha Total PP |
Lustran® ABS 261 | INEOS ABS (USA) | ABS | Lustran® ABS |
ULTEM™ EXUM0169 resin | SABIC Innovative Plastics | PEI | ULTEM™ |