| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | aZlXP5_EPO-TEK-H61LV.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 38 | ppm | |
| K+ | 40 | ppm | |
| Na+ | 239 | ppm | |
| NH4+ | 165 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 477 | °C | |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 6.33 | GPa | |
| Thixotropic Index | 1.18 | ||
| Weight Loss on Heating | |||
| 200°C | < 0.050 | % | |
| 250°C | < 0.050 | % | |
| 300°C | < 0.050 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.1E-5 | cm/cm/°C | |
| -- 3 | 9.6E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.60 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 4 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Grey, Light | ||
| Density | 2.04 | g/cm³ | |
| Viscosity 5(23°C) | 20 to 30 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 91 | ||
| Lap Shear Strength (23°C) | 3.20 | MPa | |
| Relative Permittivity (1 kHz) | 5.09 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 6.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 10 rpm |
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|---|---|---|---|
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| Ultramid® B3GM35 BK60564 | BASF Corporation | Nylon 6 | Ultramid® |
| Novodur® 240 | Styrolution | ABS | Novodur® |
| KEP® 980N | Kumho Polychem Co., Ltd. | EPDM | KEP® |
| Sylvin 9940-60 Orange 591 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |