Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | ZlPYtw_EPO-TEK-H31.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 7 | ppm | |
K+ | 41 | ppm | |
Na+ | 143 | ppm | |
NH4+ | 8 | ppm | |
Particle Size | < 45.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 370 | °C | TGA |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 5.69 | GPa | |
Thixotropic Index | 3.00 | ||
Weight Loss on Heating (250°C) | 0.060 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 110 | °C | |
CLTE - Flow | |||
-- 2 | 4.8E-5 | cm/cm/°C | |
-- 3 | 2.0E-4 | cm/cm/°C | |
Thermal Conductivity | 1.1 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life (23°C) | 13 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | Silver | ||
Density | 2.19 | g/cm³ | |
Viscosity 4(23°C) | 15 to 25 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 40000 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 84 | ||
Lap Shear Strength (23°C) | 9.10 | MPa | |
Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | 5 rpm |
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