Resinoid 2005

Category: Phenolic , Phenolic
Manufacturer: Resinoid Engineering Corporation
Trademark: Resinoid
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: ZatX1h_Resinoid-2005.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
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Resinoid 2005 is a cellulose reinforced, two-step phenolic molding compound. It exhibits excellent electrical and thermal properties and dimensional stability. This material comes in pelletized from and is suitable for transfer or compression molding. It can be preformed on automatic equipment.
General Information
Filler / Reinforcement
  • Fiber filler
Features
  • Good dimensional stability
  • Good electrical performance
Appearance
  • Black
Forms
  • Particle
Processing Method
  • Resin transfer molding
  • Compression molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.39g/cm³ASTM D792A, ISO 1183
Molding Shrinkage
    Flow 0.20 - 0.40%ASTM D955
    Flow direction 0.20 - 0.40%ISO 294-4
Water Absorption
    24 hr 1.0%ASTM D570
    23°C, 24 hr 1.0%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Strength
    Yield 41.4MPaASTM D638
    Yield 41.0MPaISO 527-2
Flexural Modulus
    -- 8270MPaASTM D790
    -- 8200MPaISO 178
Flexural Strength
    -- 68.9MPaASTM D790
    -- 69.0MPaISO 178
Compressive Strength
    -- 138MPaASTM D695
    -- 166MPaISO 604
ElectricalNominal ValueUnitTest Method
Dielectric Strength 9.8kV/mmASTM D149, IEC 60243-1
Additional Information
Density -Specific Gravity, ASTM D792, Method A: 1.38 to 1.40 g/cm³Density, ISO 1183: 1.38 to 1.40 g/cm³Water Absorption @ 24 hrs, ASTM D570: <1%Water Absorption 24h/23°C, ISO 62: <1%Dielectric Strength, ASTM D149: >250 V/milElectric Strength, IEC 60243-1: >9.8 kV/m²
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