Category: | Phenolic , Phenolic |
Manufacturer: | Resinoid Engineering Corporation |
Trademark: | Resinoid |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | ZatX1h_Resinoid-2005.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Resinoid 2005 is a cellulose reinforced, two-step phenolic molding compound. It exhibits excellent electrical and thermal properties and dimensional stability. This material comes in pelletized from and is suitable for transfer or compression molding. It can be preformed on automatic equipment. |
General Information | |
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Filler / Reinforcement |
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Features |
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Appearance |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.39 | g/cm³ | ASTM D792A, ISO 1183 |
Molding Shrinkage | |||
Flow | 0.20 - 0.40 | % | ASTM D955 |
Flow direction | 0.20 - 0.40 | % | ISO 294-4 |
Water Absorption | |||
24 hr | 1.0 | % | ASTM D570 |
23°C, 24 hr | 1.0 | % | ISO 62 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength | |||
Yield | 41.4 | MPa | ASTM D638 |
Yield | 41.0 | MPa | ISO 527-2 |
Flexural Modulus | |||
-- | 8270 | MPa | ASTM D790 |
-- | 8200 | MPa | ISO 178 |
Flexural Strength | |||
-- | 68.9 | MPa | ASTM D790 |
-- | 69.0 | MPa | ISO 178 |
Compressive Strength | |||
-- | 138 | MPa | ASTM D695 |
-- | 166 | MPa | ISO 604 |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength | 9.8 | kV/mm | ASTM D149, IEC 60243-1 |
Additional Information |
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Density -Specific Gravity, ASTM D792, Method A: 1.38 to 1.40 g/cm³Density, ISO 1183: 1.38 to 1.40 g/cm³Water Absorption @ 24 hrs, ASTM D570: <1%Water Absorption 24h/23°C, ISO 62: <1%Dielectric Strength, ASTM D149: >250 V/milElectric Strength, IEC 60243-1: >9.8 kV/m² |
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