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EPO-TEK® T6065
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | ZPZm8h_EPO-TEK-T6065.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 135 | ppm | |
| K+ | 6 | ppm | |
| Na+ | 48 | ppm | |
| NH4+ | 105 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 397 | °C | |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 5.63 | GPa | |
| Thixotropic Index | 1.88 | ||
| Weight Loss on Heating | |||
| 200°C | 0.10 | % | |
| 250°C | 0.16 | % | |
| 300°C | 0.30 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.8E-5 | cm/cm/°C | |
| -- 3 | 1.4E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.79 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | White | ||
| Density | 1.68 | g/cm³ | |
| Viscosity 4(23°C) | 80 to 120 | Pa·s | |
| Curing Time (180°C) | > 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 92 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 5.30 | ||
| Volume Resistivity (23°C) | > 1.2E+14 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.011 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-300°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 2.5 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Maxxam™ FR MF5420-0085 NHFR | PolyOne Corporation | PP, Unspecified | Maxxam™ FR |
| MAXAMID™ PA66-MOS2 BK | Pier One Polymers, Inc. | Nylon 66 | MAXAMID™ |
| Ultramid® A3X2G7 | BASF Corporation | Nylon 66 | Ultramid® |
| Accura® 55 | 3D Systems | Unspecified | Accura® |
| LUVOCOM® 19-7416 | Lehmann & Voss & Co. | Nylon 46 | LUVOCOM® |
