Epolite FH-5313

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Andover Corporation
Trademark: Epolite
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: YpC3ER_Epolite-FH-5313.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200°F and is available in premeasured kits.

USES
  • Ideal for bonding a variety of substrates such as metal, glass and plastic.
  • Potting and encapsulation
  • Excellent chemical resistance, mechanical strengths and electrical properties.
  • Meets General Electric (GE) Specification number M-2820-CR
General Information
Features
  • Good Chemical Resistance
  • Good Electrical Properties
  • High Strength
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
Forms
  • Pellets
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.17g/cm³ASTM D792
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)81ASTM D2240
MechanicalNominal ValueUnitTest Method
Tensile Strength 54.7MPaASTM D638
Flexural Strength 95.6MPaASTM D790
Compressive Strength 106MPaASTM D695
Shear Strength 5.39MPaASTM D732
ThermalNominal ValueUnitTest Method
CLTE - Flow 9.4E-5cm/cm/°CASTM E831
ElectricalNominal ValueUnitTest Method
Volume Resistivity 8.4E+14ohms·cmASTM D257
Dielectric Strength 84kV/mmASTM D149
Dielectric Constant (100 Hz)4.06ASTM D150
Dissipation Factor (100 Hz)1.0E-3ASTM D150
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Hardener Mix Ratio by Weight: 15
    Resin Mix Ratio by Weight: 100
Pot Life (25°C)30min
Thermoset Mix Viscosity 1970cPASTM D2393
Demold Time
    25°C 720min
    66°C 60min
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