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EPO-TEK® 921-FL
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Xgoleo_EPO-TEK-921-FL.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a low viscosity version of EPO-TEK® 921. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 372 | °C | |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 10.7 | GPa | |
| Thixotropic Index | 2.60 | ||
| Weight Loss on Heating | |||
| 200°C | 0.32 | % | |
| 250°C | 0.50 | % | |
| 300°C | 1.0 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.3E-5 | cm/cm/°C | |
| -- 3 | 7.7E-5 | cm/cm/°C | |
| Thermal Conductivity | 1.1 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 2.2 | ||
| Shelf Life (23°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Grey | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 2.38 | g/cm³ | |
| Viscosity 6(23°C) | 9.0 to 15 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 360 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 87 | ||
| Lap Shear Strength (23°C) | 9.05 | MPa | |
| Relative Permittivity (1 kHz) | 5.94 | ||
| Volume Resistivity (23°C) | > 6.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 9.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RheTech Thermoplastic Polyolefin FT7030-01UVEG | RheTech, Inc. | Polyolefin, Unspecified | RheTech Thermoplastic Polyolefin |
| Telcar® TL-86-K975-F | Teknor Apex Company | TPE | Telcar® |
| Spartech Polycom SCR7-7022RF | Spartech Polycom | PC | Spartech |
| Wellamid® GS25-66 22LH-N | Wellman Engineering Resins | Nylon 66 | Wellamid® |
| Gallonprene® GP210-4011 | Shenzhen Sungallon Rubber & Plastic Corporation Limited | TPE | Gallonprene® |
