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FM® 355
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | FM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | XdNSGV_FM-355.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| FM 355 is a modified epoxy adhesive formulated to maximize toughness in applications requiring hot/wet performance to 350°F (177°C) cure. It contains no asbestos or aluminum fillers which is desirable for radar transparent applications. FM 355 adhesive film is supported with a lightweight nylon carrier and will cure at 350°F (177°C) in one hour. For composite bonding applications, FM 355 adhesive provides excellent toughness and shear strength properties. It was developed for co-cure as well as secondary bonding applications. In addition, FM 355 adhesive can be co-cured with epoxy or bismaleimide (BMI) composite systems requiring post-cures of up to 475°F (246°C). |
| General Information | |
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| Mechanical | Nominal Value | Unit | |
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| Tensile Strength 1 | |||
| 24°C | 6.89 | MPa | |
| 177°C | 5.52 | MPa |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Volatiles | < 1.0 | % |
| Note Message | |
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| 1 . | Flatwise tension, 0.064 2024-T3 Alclad |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| MBA PP 2171 | MBA Polymers | PP Copolymer | MBA PP |
| DOW™ Electrical & Telecommunications DGDL-3479 BK | The Dow Chemical Company | HDPE | DOW™ Electrical & Telecommunications |
| LNP™ THERMOCOMP™ MX89510 compound | SABIC Innovative Plastics | PP, Unspecified | LNP™ THERMOCOMP™ |
| MAJORIS GE264 - 8229 | AD majoris | PP, Unspecified | MAJORIS |
| Magnobond 108 | Magnolia Plastics, Inc. | Epoxy | Magnobond |
