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FM® 57
| Category: | PI, TS , Thermoset Polyimide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | FM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | WR7ua0_FM-57.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications. Suggested Applications: Honeycomb sandwich construction Metallic bonding Non-metallic bonding |
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| Mechanical | Nominal Value | Unit | |
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| Tensile Strength 1 | |||
| 24°C | 6.14 | MPa | |
| 177°C | 4.59 | MPa | |
| Shear Strength | |||
| 24°C 2 | 24.3 | MPa | |
| 24°C 3 | 24.8 | MPa |
| Note Message | |
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| 1 . | Flatwise tensile, FM 57 film adhesive sandwich bonding |
| 2 . | FM 57 film adhesive on composite substrate |
| 3 . | FM 57 film adhesive on titanium substrate |
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| EMOPLEN® CP-R 47.70 | EMAS Plastik San.Tic.AS. | PP Copolymer | EMOPLEN® |
| Kingfa JH960 6111 | Kingfa | PC+ABS | Kingfa |
| TECACOMP® PA66 TF15 natural 4086 | Ensinger GmbH | Nylon 66 | TECACOMP® |
