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CORFIL® 625-1
| Category: | Adhesive , Adhesive |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | CORFIL® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | UYPvIb_CORFIL-625-1.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. FEATURES & BENEFITS One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range |
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| Mechanical | Nominal Value | Unit | |
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| Compressive Strength (24°C) | 20.7 to 21.4 | MPa | |
| Shear Strength 1(24°C) | 6.89 to 8.27 | MPa |
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| 1 . | Filled Tube |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RheTech Polypropylene M40P100-00 | RheTech, Inc. | PP, Unspecified | RheTech Polypropylene |
| RTP 100 GB 20 HI | RTP Company | PP Copolymer | RTP |
| DiaAlloy TAL-20 | Mitsubishi Rayon America Inc. | PC | DiaAlloy |
| Kepamid® 2340GM7 | Korea Engineering Plastics Co., Ltd | Nylon 66 | Kepamid® |
| LUVOCOM® 1105-8205 | Lehmann & Voss & Co. | PEEK | LUVOCOM® |
