DOWLEX™ 2645

Category: LLDPE , Polyethylene Resin
Manufacturer: The Dow Chemical Company
Trademark: DOWLEX™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: UTN8rS_DOWLEX-2645.pdf
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Message
DOWLEX™2645 polyethylene resin is used in the production of many industrial and consumer films (although it is not recommended for forage stretch films). The film prepared with this resin combines excellent toughness and tear resistance. The product also has very good processing performance on ordinary LLDPE processing equipment.

Application field:
  • Various industrial and consumer films

Meet the following regulatory requirements:
  • European Union (EU) No 10/2011
  • U.S. Food and Drug Administration (U.S. FDA) FCN 741
please refer to the regulations for detailed information.
General Information
Agency Ratings
  • FDA FCN 741
  • Europe No 10/2011
Forms
  • Particle
Processing Method
  • Blow film
PhysicalNominal ValueUnitTest Method
Specific Gravity 0.918g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) (190°C/2.16 kg)0.85g/10 minISO 1133
FilmsNominal ValueUnitTest Method
Film Thickness - Tested 50µm
Film Puncture Energy (50 µm)5.80JASTM D5748
Film Puncture Force (50 µm)76.0NASTM D5748
Tensile Modulus ISO 527-3
    2% secant, MD : 50 µm 139MPaISO 527-3
    2% secant, TD : 50 µm 147MPaISO 527-3
Tensile Stress ISO 527-3
    MD : Yield, 50 µm 7.50MPaISO 527-3
    TD : Yield, 50 µm 6.30MPaISO 527-3
    MD : Break, 50 µm 39.0MPaISO 527-3
    TD : Break, 50 µm 40.0MPaISO 527-3
Tensile Elongation ISO 527-3
    MD : Break, 50 µm 560%ISO 527-3
    TD : Break, 50 µm 670%ISO 527-3
Dart Drop Impact (50 µm)480gISO 7765-1/A
Elmendorf Tear Strength ASTM D1922
    MD : 50 µm 560gASTM D1922
    TD : 50 µm 910gASTM D1922
ThermalNominal ValueUnitTest Method
Vicat Softening Temperature 1107°CASTM D1525
OpticalNominal ValueUnitTest Method
Gloss (45°, 50.0 µm)59ASTM D2457
Haze (50.0 µm)10%ISO 14782
ExtrusionNominal ValueUnit
Melt Temperature 190 - 240°C
Extrusion instructions
吹塑薄膜树脂的制造条件: 模具间隙:1.5 - 2.5 mm 熔体温度:190 至 240°C 放大比:1.5 比 3.1 建议的厚度范围:10 至 150 µm
Note Message
1 .Blow molded film, BUR 2.5,1.5mm mold clearance.
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