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CELEX™ 501.C
| Category: | PC+ABS , PC/ABS Engineering Resin |
| Manufacturer: | Trinseo |
| Trademark: | CELEX™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | TpCBml_CELEX-501-C.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| CELEX 501.C is a high flow PC/ABS alloy. It combines the superior physical properties, high heat resistance of PC and the excellent processability of ABS. CELEX 501.C is designed for use in thin wall injection products and mobile phone housing. |
| General Information | |
|---|---|
| Features |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.12 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) | ASTM D1238 | ||
| 230°C/3.8 kg | 8.3 | g/10 min | |
| 250°C/5.0 kg | 30 | g/10 min | |
| 260°C/5.0 kg | 36 | g/10 min | |
| Molding Shrinkage - Flow (3.20 mm) | 0.40 to 0.60 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength (Yield, 3.20 mm) | 50.0 | MPa | ASTM D638 |
| Flexural Modulus (3.20 mm) | 2260 | MPa | ASTM D790 |
| Flexural Strength (3.20 mm) | 84.0 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C, 3.20 mm) | 540 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 100 | °C | ASTM D648 |
| Flammability | Nominal Value | Test Method | |
|---|---|---|---|
| Flame Rating 1(0.800 mm) | HB | UL 94 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80.0 | °C | |
| Drying Time | 3.0 to 4.0 | hr | |
| Rear Temperature | 215 to 230 | °C | |
| Middle Temperature | 230 to 235 | °C | |
| Front Temperature | 235 to 240 | °C | |
| Nozzle Temperature | 240 to 250 | °C | |
| Mold Temperature | 40.0 to 60.0 | °C |
| Note Message | |
|---|---|
| 1 . | This rating not intended to reflect hazards presented by this or any other material under actual fire conditions. |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Witcom PE 4L3 | Witcom Engineering Plastics B.V. | PE, Unspecified | Witcom PE |
| HiFill® PA6/6 GF/M30 HS BK | Techmer Engineered Solutions | Nylon 66 | HiFill® |
| Panlite® BN-8120R | TEIJIN LIMITED | PC | Panlite® |
| ESTOPLAST XU 6233GY01 | Ester Industries Ltd. | Nylon 66 | ESTOPLAST XU |
| Geon™ Vinyl Rigid Molding M3530 | PolyOne Corporation | PVC, Rigid | Geon™ Vinyl Rigid Molding |
