Dow ENDURANCE™ HFDA-0587 BK S Datasheet,TP, Unspecified,The Dow Chemical Company-SHANGHAI SUSHENG

Message
DOW ENDURANCE™ HFDA-0587 BK S is a specially formulated semiconductive, vulcanizable compound designed for use as an extruded conductor shield and bonded insulation shield applications in medium and high voltage crosslinked polyethylene insulated cables.(1) DOW ENDURANCE™ HFDA-0587 BK S has stable volume resistivity characteristics at elevated temperatures and is formulated with a polymer system that has demonstrated compatibility with copper and aluminum conductors. DOW ENDURANCE™ HFDA-0587 BK S meets stringent requirements for product smoothness. For conductor shield of HV and EHV cables rated above 138 kV, the supersmooth semiconductive compound, DOW ENDURANCE™ HFDA-0801 BK EC, formulated with an acetylene carbon black is recommended. Specifications DOW ENDURANCE™ HFDA-0587 BK S is designed for use in power distribution cables. Cables with conductor and insulation shielding of DOW ENDURANCE™ HFDA-0587 BK S, prepared using sound commercial fabrication practice, would be expected to meet the following specifications: AEIC: CS8, CS9 BS: 6622 CEA: WCWG-01, WCWG-02 ICEA: S-94-649, S-97-682, S-66-524 (NEMA WC7) IEC: 60502, 60840 DIN: VDE 0273, 0263 Edf: HN-33-S-23, HN-33-S-52 ESI: 09-14 HD: 620 S1 UL: 1072 (1) DOW ENDURANCE™ HFDA-0587 BK S is recommended for use in conjunction with DOW cross-linked polyethylene and tree-retardant cross-linked polyethylene compounds For other polymer insulations such as EPR and EPDM's the user is cautioned to establish the utility of DOW ENDURANCE™ HFDA-0587 BK with each formulation.

General Information
Uses	High Voltage Semiconductive Shield Semiconductive Shield Underground cable Cable guard Wire and cable applications
Agency Ratings	AEIC CS8 AEIC CS9 BS 6622 EDF HN 33-S-23 EDF HN 33-S-52 HD 620 S1 ICEA S-66-524 ICEA S-94-649 ICEA S-97-682 IEC 60502 IEC 60840 NEMA WC-7 UL 1072 VDE 0263 VDE 0273
Forms	Particle
Processing Method	Extrusion

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.09	g/cm³	ASTM D792
Environmental Stress-Cracking Resistance (100% Igepal, F0)	> 504	hr	ASTM D1693

Mechanical	Nominal Value	Unit	Test Method
Tensile Strength	16.9	MPa	ASTM D638
Tensile Elongation (Break)	320	%	ASTM D638

Aging	Nominal Value	Unit	Test Method
Tensile strength retention- 1 week (150°C)	95	%	ASTM D638
Elongation retention rate- 1 week (150°C)	95	%	ASTM D638

Thermal	Nominal Value	Unit	Test Method
Brittleness Temperature	-40.0	°C	ASTM D746

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity			ASTM D991
23°C	15	ohms·cm	ASTM D991
90°C	40	ohms·cm	ASTM D991
130°C	40	ohms·cm	ASTM D991

Additional Information
Nominal property values above represent tests on molded, stress-relieved slabs. Cure times were 15 minutes at 175°C.Smoothness DOW ENDURANCE™ HFDA-0587 BK S meets the strict standards of smoothness established for a cross linkable cable semiconductive shield compound. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The smoothness standard of DOW ENDURANCE™ HFDA-0587 BK S has been designed to meet the industry expectations for semiconductive shield materials in high voltage cables. Each batch of DOW ENDURANCE™ HFDA-0587 BK S meets the following smoothness requirement: Protrusion Height / Maximum Allowable 60-74 µm / 1 per m² >75 µm / 0 per m² Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.

Additional Information

Nominal property values above represent tests on molded, stress-relieved slabs. Cure times were 15 minutes at 175°C.Smoothness DOW ENDURANCE™ HFDA-0587 BK S meets the strict standards of smoothness established for a cross linkable cable semiconductive shield compound. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The smoothness standard of DOW ENDURANCE™ HFDA-0587 BK S has been designed to meet the industry expectations for semiconductive shield materials in high voltage cables. Each batch of DOW ENDURANCE™ HFDA-0587 BK S meets the following smoothness requirement: Protrusion Height / Maximum Allowable 60-74 µm / 1 per m² >75 µm / 0 per m² Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.

Extrusion	Nominal Value	Unit
Drying Temperature	60.0	°C
Drying Time	< 6.0	hr
Melt Temperature	115 - 140	°C

Extrusion instructions
DOW ENDURANCE™ HFDA-0587 BK S provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, melt extrusion temperatures in the suggested range of 240 to 285°F (115 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDA-0587 BK S. Specific machine settings will depend on the extruder design and must be established through conventional practices. Dehumidified hopper drying at 140°F (60°C) for up to 6 hours may be employed to remove moisture prior to extrusion.

Extrusion instructions

DOW ENDURANCE™ HFDA-0587 BK S provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, melt extrusion temperatures in the suggested range of 240 to 285°F (115 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDA-0587 BK S. Specific machine settings will depend on the extruder design and must be established through conventional practices. Dehumidified hopper drying at 140°F (60°C) for up to 6 hours may be employed to remove moisture prior to extrusion.

Category:	TP, Unspecified , Crosslinkable Semiconductive Shielding Compound with Superior Smoothness
Manufacturer:	The Dow Chemical Company
Trademark:	Dow ENDURANCE™
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	TcKsG2_Dow-ENDURANCE-HFDA-0587-BK-S.pdf
PRICE:	Order Products email sales@su-jiao.com

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