Fortron® MT9320C0

Category: PPS , Polyphenylene Sulfide
Manufacturer: Celanese Corporation
Trademark: Fortron®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: TGKQqC_Fortron-MT9320C0.pdf
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Message
Fortron MT9320C0 is an unfilled grade used for extrusion applications. It demonstrates excellent chemical resistance and thermal stability as well as a high melt strength. Components made of this grade may be used for medical, dental, pharmaceutical, and certain food handling applications. Fortron MT9320C0 is in compliance with ISO 10993, USP Class VI and it is included in the Fortron Drug and Device Master Files at the FDA. This grade complies with the FDA Food Contact Notification (FCN-No. 40) for repeat-use applications.
General Information
Features
  • Good melt strength
  • Good chemical resistance
  • Thermal stability, good
Uses
  • Non-specific food applications
  • Drug
  • Medical/nursing supplies
Agency Ratings
  • FDA FCN 40
  • ISO 10993
  • USP Class VI
RoHS Compliance
  • Contact manufacturer
Processing Method
  • Extrusion
PhysicalNominal ValueUnitTest Method
Density 1.35g/cm³ISO 1183
Water Absorption (Saturation, 23°C)0.020%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Stress (Break)85.0MPaISO 527-2/1A/5
Tensile Strain (Break)6.0%ISO 527-2/1A/5
Flexural Modulus (23°C)4200MPaISO 178
Flexural Stress (23°C)140MPaISO 178
ImpactNominal ValueUnitTest Method
Notched Izod Impact (23°C)3.5kJ/m²ISO 180/1A
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature
    1.8 MPa, not annealed 115°CISO 75-2/A
    8.0 MPa, not annealed 95.0°CISO 75-2/C
Glass Transition Temperature 190.0°CISO 11357-2
Melting Temperature 2280°CISO 11357-3
ElectricalNominal ValueUnitTest Method
Volume Resistivity 1.0E+15ohms·cmIEC 60093
Relative Permittivity (1 MHz)2.80IEC 60250
InjectionNominal ValueUnit
Drying Temperature 110 - 120°C
Drying Time 3.0 - 4.0hr
Suggested Max Moisture 0.020%
Hopper Temperature 20.0 - 30.0°C
Rear Temperature 290 - 300°C
Middle Temperature 300 - 310°C
Front Temperature 310 - 320°C
Nozzle Temperature 300 - 310°C
Processing (Melt) Temp 310 - 320°C
Mold Temperature 140 - 160°C
Injection Pressure 40.0 - 80.0MPa
Injection Rate Fast
Holding Pressure 30.0 - 60.0MPa
Back Pressure 0.00 - 3.00MPa
Injection instructions
Manifold Temperature: 310 to 320°CZone 4 Temperature: 310 to 320°CFeed Temperature: 60 to 80°C
Note Message
1 .10°C/min
2 .10°C/min
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