Category: | Nylon 66 , Polyamide 66 |
Manufacturer: | Wellman Engineering Resins |
Trademark: | Wellamid® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | T84Kur_Wellamid-GS1684-WBK1.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
---|
Wellamid® GS1684-WBK1 is a Polyamide 66 (Nylon 66) material filled with 25% glass bead. It is available in Asia Pacific, Europe, Latin America, or North America. Typical application of Wellamid® GS1684-WBK1: Automotive |
General Information | |
---|---|
Filler / Reinforcement |
|
Forms |
|
Physical | Nominal Value | Unit | Test Method |
---|---|---|---|
Density | 1.33 | g/cm³ | ISO 1183 |
Molding Shrinkage | ISO 294-4 | ||
Across Flow | 1.2 to 1.6 | % | |
Flow | 1.1 to 1.5 | % |
Mechanical | Nominal Value | Unit | Test Method |
---|---|---|---|
Tensile Stress (Yield, 23°C) | 65.0 | MPa | ISO 527-2 |
Tensile Strain (Break, 23°C) | 2.0 | % | ISO 527-2 |
Flexural Modulus (23°C) | 4100 | MPa | ISO 178 |
Flexural Stress (23°C) | 115 | MPa | ISO 178 |
Impact | Nominal Value | Unit | Test Method |
---|---|---|---|
Notched Izod Impact Strength (23°C) | 2.0 | kJ/m² | ISO 180 |
Thermal | Nominal Value | Unit | Test Method |
---|---|---|---|
Heat Deflection Temperature (1.8 MPa, Unannealed) | 80.0 | °C | ISO 75-2/A |
Melting Temperature (DSC) | 260 | °C | ISO 3146 |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
Tekumid 6 BS | TEKUMA Kunststoff GmbH | Nylon 6 | Tekumid |
Topolymer® M-651Z | Dongguan Top Polymer Enterprise | TPE | Topolymer® |
CYCOM® 919 | Cytec Industries Inc. | Epoxy | CYCOM® |
Evoprene™ LF 6151 | AlphaGary | SBC | Evoprene™ LF |
Electrafil® ABS SS7 BK MB | Techmer Engineered Solutions | ABS | Electrafil® |