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STABAMID® 25 RS 9
| Category: | Nylon 66 , Polyamide 66 |
| Manufacturer: | Solvay Polyamide & Intermediates |
| Trademark: | STABAMID® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | SoSg1V_STABAMID-25-RS-9.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| Full-dull, Stabilized |
| General Information | |
|---|---|
| Additive |
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| Features |
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| Uses |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Density | 1.14 | g/cm³ | |
| Apparent Density | 0.70 | g/cm³ | |
| Humidity - at Packaging | < 0.40 | % | |
| Relative Viscosity | |||
| Formic Acid 90% | 41.7 | ||
| Sulfuric Acid 96% | 2.52 | ||
| Viscosity | |||
| Formic Acid 90% | 124 | cm³/g | |
| Sulfuric Acid 96% | 136 | cm³/g |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Amino End Groups | 56 | meq/kg | |
| Carboxyl End Groups | 80.9 | meq/kg | |
| Granulometry 1 | 3.00 |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Melting Temperature 2 | 257 | °C | |
| Peak Crystallization Temperature (DSC) | 214 | °C |
| Note Message | |
|---|---|
| 1 . | g/100 chips |
| 2 . | 2nd melting |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Desmopan® DP 1050D | Covestro - PUR | TPU, Unspecified | Desmopan® |
| HiFill® PA6 GF/B20 A2 | Techmer Engineered Solutions | Nylon 6 | HiFill® |
| LOXIM 811 02T HB | LOXIM Industries Private Limited | PP Copolymer | LOXIM |
| PERCOM® KCS09HI | A. Schulman Europe | PP Copolymer | PERCOM® |
| LNP™ THERMOCOMP™ JF003E compound | SABIC Innovative Plastics | PESU | LNP™ THERMOCOMP™ |
