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CONTINUUM™ DMDA-1250 NT 7

Category:	HDPE , Bimodal Polyethylene Resin
Manufacturer:	The Dow Chemical Company
Trademark:	CONTINUUM™
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	RsFn27_CONTINUUM-DMDA-1250-NT-7.pdf
PRICE:	Order Products email sales@su-jiao.com

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CONTINUUM™DMDA -1250 NT 7 bimodal high density polyethylene resin (HDPE) was prepared using Dow's Unipol II™Process technology for compression molding and injection processing such as capping. This resin can bring excellent processing performance to processors and meet the strict requirements for environmental stress cracking resistance, stiffness and impact strength.

Main features:

High performance resin

There is a balance between higher ESCR, stiffness and processing performance

Excellent sensory performance

Comply with the following regulations

U.S. Food and Drug Administration Regulation 21 CFR 177.1520 (c) 3.2 a

Meet the requirements of the Canadian Health Products and Food Agency (HPFB): No objections (with restrictions)

European Commission Regulation (EU) No 10/2011

please check the regulations for complete details.

General Information
Agency Ratings	FDA 21 CFR 177.1520(c) 3.2a HPFB (Canada) No Objection 2 Europe 10/1/2011 12:00:00 AM
Forms	Particle
Processing Method	Compression molding Injection molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	0.955	g/cm³	ASTM D792
Melt Mass-Flow Rate (MFR) (190°C/2.16 kg)	1.5	g/10 min	ASTM D1238
Environmental Stress-Cracking Resistance			ASTM D1693
50°C, 10% Igepal, F50	272	hr	ASTM D1693
50°C, 100% Igepal, F50	> 2000	hr	ASTM D1693

Mechanical	Nominal Value	Unit	Test Method
Tensile Strength			ASTM D638
Yield	28.3	MPa	ASTM D638
Fracture	22.1	MPa	ASTM D638
Tensile Elongation			ASTM D638
Yield	9.0	%	ASTM D638
Fracture	690	%	ASTM D638
Flexural Modulus - 2% Secant	1100	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Deflection Temperature Under Load (0.45 MPa, Unannealed)	68.3	°C	ASTM D648
Vicat Softening Temperature	127	°C	ASTM D1525
Melting Temperature (DSC)	130	°C	Internal method
Peak Crystallization Temperature (DSC)	117	°C	Internal method

Additional Information
根据 ASTM D 4976 进行基板模制和测试。

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