Devcon 5 Minute® Epoxy Gel

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Devcon
Trademark: Devcon
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: RQeLA2_Devcon-5-Minute-Epoxy-Gel.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
Thixotropic/non-migrating gel adhesive with excellent gap-filling properties.

Intended Use:
  • Bonding metal, ceramic, wood and vertical surface where gap-filling is needed.

Product features:
  • Good solvent resistance
  • Fills gaps to .250 inches
  • Non-sagging adhesive
General Information
Features
  • thixotropic
  • Solvent resistance
  • Mobility Low to None
Uses
  • Bonding
  • Adhesive
Appearance
  • Opacity
Forms
  • Gel
PhysicalNominal ValueUnitTest Method
Specific Volume 0.856cm³/g
Solid content- by Volume 100%
ImpactNominal ValueUnit
Impact Resistance 13.7kJ/m²
ThermalNominal ValueUnit
Service Temperature -40 - 93°C
ThermosetNominal ValueUnitTest Method
Work Time 4.0 - 7.0min
Additional InformationNominal ValueUnitTest Method
Tensile Shear Adhesion 17.2MPaASTM D1002
PhysicalNominal ValueUnitTest Method
Density 11.17g/cm³
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)80ASTM D2240
MechanicalNominal ValueUnit
Tensile Elongation (Break)5.0%
ElectricalNominal ValueUnitTest Method
Dielectric Strength 17kV/mmASTM D149
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Component a Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0
    Component B Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0
Additional InformationNominal ValueUnitTest Method
Cured 7 days @ 75°F
Uncured PropertiesNominal ValueUnitTest Method
Curing Time 48hr
Note Message
1 .Mixed
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