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E-Pos 558
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epocat Nederland BV |
| Trademark: | E-Pos |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | RGGTlR_E-Pos-558.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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E-Pos 558 is a low viscosity epoxy resin based on Bisphenol A and Bisphenol F and diluted with a difunctional reactive diluent. E-Pos 558 is crystallisation-resistant. Product applications E-Pos 558 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 558 enables the preparation of systems providing excellent chemical resistance. E-Pos 558 can be used in civil engineering applications such as sealers, self-leveling floorings, trowellable floorings or mortars, but also in the formulation of solventfree coatings exhibiting a good resistance to chemicals. |
| General Information | |
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| Physical | Nominal Value | ||
|---|---|---|---|
| Gardner Color | < 2.00 |
| Additional Information | Nominal Value | Unit | |
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| Epoxy Equivalent | 165 to 180 | g/mol |
| Uncured Properties | Nominal Value | Unit | |
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| Solids Content | 100 | % | |
| Density (20°C) | 1.10 | g/cm³ | |
| Viscosity (25°C) | 0.60 to 0.80 | Pa·s |
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| DURANEX® 701SA | Polyplastics Co., Ltd. | ABS+PBT | DURANEX® |
| KumhoSunny ASA XC230-HW | Shanghai KumhoSunny Plastics Co., Ltd. | ASA | KumhoSunny ASA |
| POLYFLAM® RIPP 490 E | A. Schulman Europe | PP Copolymer | POLYFLAM® |
