BR® 624

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Cytec Industries Inc.
Trademark: BR®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: QgouOk_BR-624.pdf
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BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 to 350°F (-57 to 177°C).

BR 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material.

Suggested Applications:
Insert and edge filling of honeycomb structures
General Information
Features
  • Low Density
  • Thixotropic
Uses
  • Filling Applications
  • Structural Parts
Appearance
  • Maroon
Forms
  • Paste
Processing Method
  • Potting
  • Thermoforming
PhysicalNominal ValueUnit
Specific Gravity 10.650g/cm³
Note Message
1 .Approximate
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