EASYPOXY® K-230

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Cytec Industries Inc.
Trademark: EASYPOXY®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: QQ73dm_EASYPOXY-K-230.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EASYPOXY K-230 Optically Clear Kit is a two-component, 100% solids system that is used in thin films to bond glass. This adhesive is recommended for bonding substrates with widely different coefficients of expansion because of its cured resiliency. This same resiliency favors bonding elastomeric to rigid substrates. Its neutral color 's an advantage where the bond line should not be noticeable.
General Information
Uses
  • Films
  • Bonding
Appearance
  • Clear/transparent
Forms
  • Adhesive
PhysicalNominal ValueUnit
Specific Gravity
    -- 11.08g/cm³
    -- 21.17g/cm³
Molding Shrinkage - Flow 0.67%
Water Absorption 3(25°C, 24 hr)0.37%
Solids Content
    Part A - Resin 100%
    Part B - Hardener 100%
Viscosity
    Part A - Resin : 25°C Light Paste
    Part B - Hardener : 25°C Light paste
Additional InformationNominal ValueUnit
Antifungal Non-nutrient
HardnessNominal ValueUnit
Durometer Hardness (Shore D)80
MechanicalNominal ValueUnit
Tensile Strength 4
    -55°C 9.38MPa
    25°C 16.9MPa
    82°C 10.5MPa
Flexural Strength 68.9MPa
Compressive Strength 124MPa
ThermalNominal ValueUnit
Thermal Conductivity 0.21W/m/K
ElectricalNominal ValueUnit
Volume Resistivity (25°C)4.0E+13ohms·cm
Dielectric Constant (25°C, 1 kHz)4.60
Dissipation Factor (25°C, 1 kHz)0.012
ThermosetNominal ValueUnit
Thermoset Components
    Resin Mixing ratio by weight: 100
    Hardening method Mixing ratio by weight: 45
Pot Life (25°C)60min
Shelf Life 78wk
Demold Time
    25°C 1400 - 2200min
    65°C 120min
Note Message
1 .Hardener
2 .Resin
3 .Immersion
4 .Etched AL/AL
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