Plaskon PPF-165 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor manufacturing productivity and reduces production costs.

General Information
Features	Semi-conductive Low viscosity Fast curing
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.80	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.30	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus	1.52	MPa	ASTM D790
Flexural Strength	0.0124	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	130	°C	ASTM E1356
CLTE - Flow	2.1E-5	cm/cm/°C	ASTM D696

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	5.0E+15	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.50		ASTM D150
Dissipation Factor (1 kHz)	3.0E-3		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	30	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 165°C, 1000 psi: 72 cmSpiral Flow, 175°C, 1000 psi: 72 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 11 poiseAutomatic Orifice Viscosity, 165°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 165°C: 18 secRam Follower Gel Time, 175°C: 12 secAsh Content: 72 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 165°C: 80Cull Hot Hardness, Shore D, 90 sec, 175°C: 90Gangpot Hot Hardness, Shore D, 30 sec, 165°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°CThe following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity14 cal/cm-sec-°C The following information was transfer molded and post cured for 30 seconds at 175°C Glass Transition Temperature Tg: 130°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 30 seconds at 165°C Glass Transition Temperature Tg: 135°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 165°C, 1000 psi: 72 cmSpiral Flow, 175°C, 1000 psi: 72 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 11 poiseAutomatic Orifice Viscosity, 165°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 165°C: 18 secRam Follower Gel Time, 175°C: 12 secAsh Content: 72 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 165°C: 80Cull Hot Hardness, Shore D, 90 sec, 175°C: 90Gangpot Hot Hardness, Shore D, 30 sec, 165°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°CThe following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity14 cal/cm-sec-°C The following information was transfer molded and post cured for 30 seconds at 175°C Glass Transition Temperature Tg: 130°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 30 seconds at 165°C Glass Transition Temperature Tg: 135°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Injection instructions
Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 60 sec Cycle Time, 165°C: 60 to 90 sec Cure Time, 177°C: 0 to 15min Post Mold Cure Time, 175°C: 0 to 15 hr Gangpot Resin TransferMolding: Preheat Temperature: 165°C Molding Temperature: 35 to 70°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <30 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

Injection instructions

Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 60 sec Cycle Time, 165°C: 60 to 90 sec Cure Time, 177°C: 0 to 15min Post Mold Cure Time, 175°C: 0 to 15 hr Gangpot Resin TransferMolding: Preheat Temperature: 165°C Molding Temperature: 35 to 70°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <30 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	Q5pP9V_Plaskon-PPF-165.pdf
PRICE:	Order Products email sales@su-jiao.com

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