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EPO-TEK® 731
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | OwDi8r_EPO-TEK-731.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor packaging, electronics, medical, and optical industries. A higher viscosity version of EPO-TEK® 730. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 417 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 1.36 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.47 | % | |
| 250°C | 0.92 | % | |
| 300°C | 1.6 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 55.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 7.4E-5 | cm/cm/°C | |
| -- 3 | 1.7E-4 | cm/cm/°C |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Tan | ||
| -- 5 | Tan | ||
| Density | |||
| Part B | 0.968 | g/cm³ | |
| Part A | 1.12 | g/cm³ | |
| Viscosity 6(23°C) | 180 to 280 | Pa·s | |
| Curing Time (80°C) | 2.0 | hr | |
| Pot Life | 90 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 66 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.38 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.028 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 1.0 rpm |
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| 4DUR® 9K22130 HFR1 | 4Plas | PBT | 4DUR® |
| Adiprene® L 42 | Chemtura | PUR-Ether/TDI | Adiprene® |
| Devlon ABS | Devol® Engineering Polymers | ABS | Devlon |
| Panlite® ML-3500ZNL | TEIJIN LIMITED | PC | Panlite® |
