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INSUL-PLATE™ X-28057-2HT
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Sumitomo Bakelite North America, Inc. |
| Trademark: | INSUL-PLATE™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | ObOWxx_INSUL-PLATE-X-28057-2HT.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. Vyncolit Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications. |
| General Information | |
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| Features |
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| Uses |
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| Appearance |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.99 | g/cm³ | ASTM D792 |
| Apparent Density | 0.80 | g/cm³ | ASTM D1895 |
| Molding Shrinkage - Flow | 0.60 | % | ASTM D955 |
| Water Absorption (23°C, 24 hr) | 0.060 | % | ASTM D570 |
| Water Absorption - 48 hr (50°C) | 0.20 | % | ASTM D570 |
| Bulk Factor | 3.00 to 4.00 | ASTM D954 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Insulation Resistance | 1.0E+15 | ohms·cm | ASTM D257 |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Mold Temperature (other) - Compression | 143 to 177 | °C | |
| Molding Pressure - Compression | 1.38 to 13.8 | MPa |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength (Break) | 51.0 | MPa | ASTM D638 |
| Flexural Modulus | 13800 | MPa | ASTM D790 |
| Flexural Strength | 96.0 | MPa | ASTM D790 |
| Compressive Strength | 172 | MPa | ASTM D695 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact | 18 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| CLTE - Flow | ASTM E831 | ||
| 40 to 125°C 1 | 2.5E-5 | cm/cm/°C | |
| 40 to 125°C 2 | 2.9E-5 | cm/cm/°C | |
| 40 to 190°C 3 | 2.8E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.63 | W/m/K | ASTM C518 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E+14 | ohms·cm | ASTM D257 |
| Dielectric Strength | 14 | kV/mm | ASTM D149 |
| Dielectric Constant 4(1 MHz) | 5.25 | ASTM D2520 | |
| Dissipation Factor 5(1 MHz) | 8.0E-3 | ASTM D150 | |
| Arc Resistance | 180 | sec | ASTM D495 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (4°C) | > 26 | wk |
| Note Message | |
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| 1 . | Post Cured |
| 2 . | As Molded |
| 3 . | Post Cured |
| 4 . | Dry |
| 5 . | Dry |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Thermec™ 4150CF30 | Technical Polymers, LLC | PPS | Thermec™ |
| Xuchuan XWB-3330 | Xuchuan Chemical (Suzhou) Co., Ltd | PUR, Unspecified | Xuchuan |
| XAREC™ S135 | Idemitsu Kosan Co., Ltd. | SPS | XAREC™ |
| Conpol™ 20B | DuPont Packaging & Industrial Polymers | EMAA | Conpol™ |
| Dynalloy™ GP 7810-30T | PolyOne Corporation | TPE | Dynalloy™ |
