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NEMCON H ES DP110/X3
| Category: | PC Alloy , Polycarbonate Alloy |
| Manufacturer: | Ovation Polymers Inc. |
| Trademark: | NEMCON H |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | OUvOAW_NEMCON-H-ES-DP110-X3.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.49 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1(23°C) | 3180 | MPa | ASTM D638 |
| Tensile Strength 2(Break, 23°C) | 47.0 | MPa | ASTM D638 |
| Tensile Elongation 3(Break, 23°C) | 1.7 | % | ASTM D638 |
| Flexural Modulus 4(23°C, 50.0 mm Span) | 7350 | MPa | ASTM D790 |
| Flexural Strength 5(Break, 23°C, 50.0 mm Span) | 75.0 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 19 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 113 | °C | ASTM D648 |
| Thermal Conductivity (23°C) | 3.5 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 8.0E+12 | ohms | ASTM D257 |
| Additional Information |
|---|
| The value listed as Thermal Conductivity, ASTM C177 was tested in accordance with ASTM E1461. |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| 2 . | 50 mm/min |
| 3 . | 50 mm/min |
| 4 . | 1.3 mm/min |
| 5 . | 1.3 mm/min |
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