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Ablefilm ECF561E
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Henkel Ablestik |
| Trademark: | Ablefilm |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | O82God_Ablefilm-ECF561E.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Appearance |
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| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 47.0 | °C | DSC |
| CLTE - Flow | ASTM D696 | ||
| < 47°C | 1.0E-4 | cm/cm/°C | |
| > 47°C | 3.8E-4 | cm/cm/°C | |
| Thermal Conductivity (121°C) | 1.6 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk | |
| Post Cure Time | |||
| 125°C | 2.0 | hr | |
| 150°C | 1.0 | hr |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Bond Joint Resistance | 0.00200 | ohms/in² | |
| Carrier Resin | Glass fabric | ||
| Lap Shear | |||
| Al to Al | 13.8 | MPa | |
| Au to Au | 14.5 | MPa | |
| Weight Loss on Heating (300°C) | 0.55 | % |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 200.5 | RTP Company | Nylon 66 | RTP |
| MegaCarb® 510FR-U | Mega Polymers | PC | MegaCarb® |
| Sylvin 8200-95UV Grey 9539 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |
| ACRYLITE® Film 0F014 | Evonik Cyro LLC | Film, PMMA | ACRYLITE® Film |
| Cri-Line GP-715 | Cri-Tech, Inc. | Fluorelastomer | Cri-Line |
