NuSil EPM-2411-2

Category:	Silicone , Silicone
Manufacturer:	NuSil Technology
Trademark:	NuSil
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	O41Rig_NuSil-EPM-2411-2.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

Message
As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Glob Tops Comments: Glob Top encapsulant. Shear Thinning Index 2.5

Message

As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:

Wide Operating Temperature Range of -115 °C to 250 °C

Low moisture absorption, < 0.4% Typical

Corrosion Resistance

High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm

Fillers can be added to provide thermal and electrical conductive properties

Low Modulus (Typically less than 5.5 MPa/800 psi)

Stable chemical and mechanical properties when exposed to high temperatures

Low Shrinkage

Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Glob Tops

Comments: Glob Top encapsulant. Shear Thinning Index 2.5

General Information
Features	Good Corrosion Resistance Good Thermal Stability Low Moisture Absorption Low Shrinkage
Uses	Electrical/Electronic Applications

Electrical	Nominal Value	Unit	Test Method
Dielectric Strength	16	kV/mm	ASTM D149

Additional Information	Nominal Value	Unit
Cure System	Platinum
Operating Temperature	-65 to 250	°C

Uncured Properties	Nominal Value	Unit
Color	Black
Density	1.16	g/cm³
Viscosity	300	Pa·s
Curing Time (200°C)	0.25	hr
Pot Life	> 480	min

Cured Properties	Nominal Value	Unit
Shore Hardness (Shore A)	17
Tensile Strength	5.17	MPa
Tensile Elongation at Break	700	%
Tear Strength	9.63	kN/m

Resin Grade	Manufacturer	Category	Trademark
PRIMACOR™ 3003	The Dow Chemical Company	EAA	PRIMACOR™
FERREX® GPP20CK03HB-NA	Ferro Corporation	PP, Unspecified	FERREX®
DynaPath™ C2245CFT	Polymer Dynamix	PC	DynaPath™
LTP ZE-2601 Al2O3/GF 30%	Chengdu Letian Plastics Co., Ltd	TP, Unspecified	LTP
ULTEM™ HU1004 resin	SABIC Innovative Plastics	PEI	ULTEM™