EPO-TEK® H70E-2

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: NidU6Y_EPO-TEK-H70E-2.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
General Information
Features
  • Electrically Insulating
  • Fast Cure
  • Good Adhesion
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type - Cl- 267ppm
Particle Size < 50.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 447°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 8.37GPa
Thixotropic Index 1.69
Weight Loss on Heating
    200°C 0.10%
    250°C 0.30%
    300°C 0.70%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 80.0°C
CLTE - Flow
    -- 22.0E-5cm/cm/°C
    -- 31.1E-4cm/cm/°C
Thermal Conductivity 1.0W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Black
    -- 5Cream
Density
    Part A 1.50g/cm³
    Part B 2.29g/cm³
Viscosity 6(23°C)9.0 to 15Pa·s
Curing Time (150°C)1.0hr
Pot Life 2900min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)65
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)5.19
Volume Resistivity > 8.0E+12ohms·cm
Dissipation Factor (1 kHz)7.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part A
5 .Part B
6 .20 rpm
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